SZ-HK innovation cooperation a highlight of fair

Cai Yingbo

The cooperation between Shenzhen and Hong Kong will be highlighted at the 10th China Hi-Tech Fair (CHIF) to be held from Oct. 12 to 17 at the Shenzhen Convention and Exhibition Center.

It will be the first time for the “Shenzhen-Hong Kong Innovation Circle” exhibition to be staged at the fair, which signifies closer cooperation in the high-tech sector between the two cities, Liu Yingli, vice director and secretary general of the organizing committee of the 10th CHTF, said at a conference in Beijing recently.

Approved by the Central Government, Shenzhen and Hong Kong signed an agreement in May last year to build a “Shenzhen-Hong Kong Innovation Circle,” designed to pool their innovative resources, particularly in the fields of technological innovation.

“The governments plan to build a research center in Hong Kong and a manufacturing facility in Shenzhen for amorphous silicon thin film to support the solar energy sector, which can be a good example of the achievement of the cooperation agreement,” Liu Jin, vice director general of the Shenzhen Municipal Bureau of Science, Technology and Information, told the conference.

Liu said more than 10 important high-tech projects would be developed by the two cities. A number of Hong Kong capital enterprises would attend the high-tech fair.

“This year is the 10th anniversary of the high-tech fair and the 30th anniversary of China’s reform and opening up. Shenzhen should make great efforts to hold the most successful high-tech fair in its history,” Mayor Xu Zongheng said at a press conference Tuesday.

Well-known overseas financial institutions, including the stock exchanges of London, Frankfurt and Tokyo, the NYSE Euronext and Nasdaq, had confirmed they would be attending the “Capital Market Summit Forum” to be held during the fair.

Apart from lectures and forums for entrepreneurs, scientists and government officials, organizers will also invite ministers from other countries to showcase their scientific achievements. Overseas delegations from Russia, Finland, Germany, France and the Netherlands have already reserved booths at the fair.

Well-known enterprises will be invited to recruit senior talent, providing some 3,000 vacancies in the fields of electronics, telecommunications and computers, new material and new energy, biology and pharmaceuticals.